产品 产品信息
10 10 2016

苏州Bayblend 注塑级T85XF

当前位置: 首页> 石油、化工> 树脂用原料> 其他树脂原料
来源:[东莞市大田化工有限公司]
联系人：赵先生
手机：13662889445
电话：0769-84393119
传真：0769-84393119
QQ：286928167
Email：1423969852@qq.com
地址：广东省东莞市东莞市常平司马管理区洲寮新街二十三号
品牌：Bayblend
价格：面议 元/KG
供应地：广东省东莞市
产品型号：T85XF

Bayblend T85XF
PC/ABS

注塑级，维卡/ B 120温度= 130°C，比T85更好的流动性。

[Datasheet Bayblend T85 XF]

Property Test Condition Unit Standard typical Value
Rheological properties
campus image Melt volume-flow rate 260 °C; 5 kg cm3/10 min ISO 1133 19
  Molding shrinkage, parallel 150x105x3 mm; 260 °C / MT 80 °C % b.o. ISO 2577 0.5 - 0.7
  Molding shrinkage, normal 150x105x3 mm; 260 °C / MT 80 °C % b.o. ISO 2577 0.5 - 0.7
  Melt viscosity 1000 s-1; 260 °C Pa·s b.o. ISO 11443-A 250
Mechanical properties (23 °C/50 % r. h.)
campus image Tensile modulus 1 mm/min MPa ISO 527-1,-2 2300
campus image Yield stress 50 mm/min MPa ISO 527-1,-2 54
campus image Yield strain 50 mm/min % ISO 527-1,-2 4.7
  Stress at break 50 mm/min MPa ISO 527-1,-2 50
  Strain at break 50 mm/min % b.o. ISO 527-1,-2 > 50
  Izod impact strength 23 °C kJ/m2 ISO 180-U N
  Izod impact strength -30 °C kJ/m2 ISO 180-U N
  Izod notched impact strength 23 °C kJ/m2 ISO 180-A 48
  Izod notched impact strength -30 °C kJ/m2 ISO 180-A 35
Thermal properties
campus image Temperature of deflection under load 1.80 MPa °C ISO 75-1,-2 109
campus image Temperature of deflection under load 0.45 MPa °C ISO 75-1,-2 127
campus image Vicat softening temperature 50 N; 50 °C/h °C ISO 306 128
  Vicat softening temperature 50 N; 120 °C/h °C ISO 306 130
campus image Coefficient of linear thermal expansion, parallel 23 to 55 °C 10-4/K ISO 11359-1,-2 0.75
campus image Coefficient of linear thermal expansion, transverse 23 to 55 °C 10-4/K ISO 11359-1,-2 0.8
campus image Burning behavior UL 94 [UL recognition] 0.85 mm Class UL 94 HB
Electrical properties (23 °C/50 % r. h.)
campus image Relative permittivity 100 Hz - IEC 60250 3.1
campus image Relative permittivity 1 MHz - IEC 60250 3.0
campus image Dissipation factor 100 Hz 10-4 IEC 60250 20
campus image Dissipation factor 1 MHz 10-4 IEC 60250 85
campus image Volume resistivity   Ohm·m IEC 60093 1E14
campus image Surface resistivity   Ohm IEC 60093 1E16
campus image Electrical strength 1 mm kV/mm IEC 60243-1 35
campus image Comparative tracking index CTI Solution A Rating IEC 60112 225
Other properties (23 °C)
campus image Water absorption (saturation value) Water at 23 °C % ISO 62 0.7
campus image Water absorption (equilibrium value) 23 °C; 50 % r. h. % ISO 62 0.2
campus image Density   kg/m3 ISO 1183-1 1140
Processing conditions for test specimens
campus image Injection molding-Melt temperature   °C ISO 294 260
campus image Injection molding-Mold temperature   °C ISO 294 80
campus image Injection molding-Injection velocity   mm/s ISO 294 240

Disclaimer

电话咨询获取底价